May
20

VinUni-CMIT and NYCU-ICST Deepen Strategic Partnership with a Joint Scientific Webinar

Hanoi, Vietnam — On Wednesday, May 20, 2026, the Center for Materials Innovation & Technology (CMIT) at VinUniversity and the International College of Semiconductor Technology (ICST) at National Yang Ming Chiao Tung University (NYCU) successfully co-hosted a comprehensive Online Scientific Webinar. 

Marking the major academic exchange between the two institutions in just the past two months, this event highlights a rapidly strengthening collaborative bond and opens significant new avenues for joint scientific research. 

The half-day event featured two intensive sessions showcasing cutting-edge research from leading experts at both universities: 

  • Session I (ICST, NYCU): Highlighted critical advancements in semiconductor technology, including 3DIC, lithium chemistry for next-generation batteries, power electronics packaging, and the computational design of low-dimensional materials for energy applications. 
  • Session II (CMIT, VinUniversity): Showcased CMIT’s pioneering work across a diverse range of topics. Presentations from prominent researchers, including Prof. Phan Manh Huong and other esteemed faculty members, covered opportunities in 2D magnetism and quantum materials, phase field modeling, advanced computational and AI approaches in materials science, energy materials, and MOF-based electrocatalysts for sustainable green hydrogen evolution. 

The webinar concluded with an engaging panel discussion, fostering dynamic dialogue and knowledge-sharing among international scholars. 

Building on the momentum of these consecutive bilateral meetings, both CMIT and ICST are transitioning from dialogue to actionable collaboration. In the coming weeks, both sides will conduct focused internal discussions. The immediate goal is to form dedicated, cross-institutional research teams aligned with the specific topics and research directions explored during the webinar. 

By matching expertise and resources, CMIT and ICST aim to fast-track the deployment of joint projects, driving forward innovation in materials science and semiconductor technology.